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ASMPT in Arizona

By Arizona AI · Profile reviewed · 26 sourced facts

At a glance

ASMPT Limited supplies machines and software used to assemble and package semiconductor chips and to build electronic circuit boards, and its Semiconductor Solutions business has its Americas office, ASMPT SEMI USA, Inc., in Tempe, Arizona. ASMPT's global portfolio includes die bonding and thermo-compression bonding systems used in advanced chip packaging for AI computing. ASMPT is headquartered in Singapore and listed on the Hong Kong Stock Exchange; ASM International, the company ASMPT began under in 1975, holds about a quarter of its shares.

Key facts

Arizona location
Headquarters
Singapore
Ownership
Public company
Hong Kong Stock Exchange: 0522
Website
asmpt.com

Sources: ASMPT: ASMPT Global Offices | ASMPT SEMI Solutions, ASMPT: ASMPT Investor Relations · Addresses open Google Maps in a new tab

ASMPT in Arizona: Key Developments

How does ASMPT fit into AI?

Modern AI runs on physical silicon, and that silicon passes through several hands before it ever answers a question. Here is the path, and where ASMPT sits on it. Stages not marked below are shown for context and are not claims about ASMPT.

  1. Chip design: Companies like Nvidia, Apple and AMD design the chips. Chip designers decide what a chip does and hand the blueprint to a factory. The three companies whose designs matter most to AI - Nvidia, Apple and AMD - do that work elsewhere, then send the designs to fabs. None of them owns a fab of its own.
  2. Wafer fabrication: Fabs print billions of transistors onto silicon wafers. A fab prints a design onto a polished disc of silicon called a wafer, layer by layer, until billions of transistors exist where there was blank material. It is the hardest and most expensive step in the chain, and the reason a single factory can cost tens of billions of dollars.
  3. Advanced packaging (here today): Wafers are cut and assembled into finished chips. Chip assembly and packaging equipment. Packaging cuts a finished wafer into individual chips and assembles them, often stacking several pieces of silicon and memory into one component. For AI chips this step is nearly as demanding as fabrication, and a wafer is not a usable product until it is done.
  4. Servers and devices: Chips are built into AI servers, phones and PCs. Finished chips are assembled into the things people actually buy and deploy: data-center servers, phones, laptops. This is where a chip stops being a component and starts being a product.
  5. AI in use: Data centers and devices run AI models on that silicon. The end of the chain: models answering questions, generating images and driving software, running on the silicon every earlier step produced. Every AI service anyone uses is running on physical hardware somewhere, and that hardware started as a wafer.

ASMPT: Advanced packaging (here today)

  • How its equipment relates to AI (company-reported): ASMPT's thermo-compression bonding systems connect chips to substrates in advanced packages used for AI computing hardware. Source: ASMPT
  • Photonics and AI interconnects (company-reported): ASMPT reported orders for equipment used in optical modules and transceivers for AI data-center networking. Source: ASMPT

About ASMPT

What ASMPT does

ASMPT Limited makes hardware and software used to assemble and package chips and build electronic circuit boards. ASMPT is headquartered in Singapore and is publicly traded on the Hong Kong Stock Exchange as 0522.

Chip assembly: ASMPT's Semiconductor Solutions division sells machines that bond individual chips to their packages, connect fine wires, seal devices and carry out specialized assembly steps. Its range includes thermo-compression and hybrid bonding equipment for advanced chip packaging.

Electronics manufacturing: ASMPT also sells DEK printing and SIPLACE component-placement systems for mounting parts onto electronic boards. Critical Manufacturing, another ASMPT business, provides factory-management software. In January 2026 ASMPT began assessing strategic options for its SMT Solutions business, including a sale, joint venture, spin-off or public listing, or keeping it.

Corporate background: ASMPT started in 1975 as the Asian marketing arm of the Netherlands-based ASM International. The business listed in Hong Kong in 1989 and established its global headquarters in Singapore in 2011. ASMPT's 2026 interim report lists ASM International, through its subsidiary ASM Pacific Holding B.V., as holding 24.55% of ASMPT's shares on June 30, 2026; the two companies are separately listed and run. See ASM International's separate Arizona profile for that company's operations.

In Arizona

Tempe office: ASMPT's official Semiconductor Solutions locations page lists ASMPT SEMI USA, Inc. in Tempe as the division's only office in the Americas. The separately published ASMPT AMICRA contact page also directs U.S. inquiries to the same Tempe address.

What the Tempe office does: The Tempe office serves ASMPT's semiconductor assembly and packaging equipment business. ASMPT SEMI USA, Inc. is registered with the Arizona Corporation Commission with the Tempe office as its place of business and trading of semiconductor equipment and materials as its line of business. Until October 2022 the same company was listed as ASM Pacific Assembly Products, Inc., and the oldest entry in its Arizona filing history is its 1995 annual report, filed April 16, 1996. ASMPT's results and order announcements cover its worldwide business; none of their figures are Tempe staffing, output or sales.

Group scale, worldwide: ASMPT reported HK$8.85 billion in group bookings and HK$5.25 billion in revenue from continuing operations for the three months ending September 30, 2026. Bookings are new customer orders, not completed sales.

Role in AI and chips

Joining chips into working packages: Advanced AI processors can combine multiple chips or chiplets in one package. ASMPT makes thermo-compression bonding equipment used to attach chips precisely to other chips or substrates.

Orders for AI packaging: On July 29, 2026, ASMPT announced bulk orders for more than 50 chip-to-substrate thermo-compression bonding tools from outsourced chip-assembly and testing companies.

Research with IBM: ASMPT and IBM renewed work on thermo-compression and hybrid bonding in July 2024 to advance packaging for chiplets used in AI systems.

Photonics: ASMPT's October 2026 results describe demand for equipment serving optical transceivers and modules that transfer data in AI data centers.

Controversies and Issues

Shenzhen plant closure (2025): In August 2025 ASMPT decided to close ASMPT Equipment (Shenzhen) Co., Ltd., a Semiconductor Solutions plant in Shenzhen, China, affecting approximately 950 staff; ASMPT said its other key global manufacturing operations were unaffected. In its third-quarter 2025 results on October 28, 2025, ASMPT said the voluntary liquidation of the Shenzhen company was proceeding as planned and booked HK$355 million for restructuring and inventory write-offs. ASMPT's 2026 interim report, published in August 2026, describes the Shenzhen company as closed in the third quarter of 2025.

ASMPT in Arizona: By the Numbers

Each figure is dated and linked to its source. Figures that are company-reported, announced, or projected rather than measured are labeled.

  • Arizona office: ASMPT SEMI USA, Inc. in Tempe, Arizona (company-reported)
  • Business represented at the Tempe office: ASMPT Semiconductor Solutions (SEMI), which sells chip assembly and packaging equipment (company-reported)
  • AI-related bonding tools ordered worldwide (July 2026): More than 50 tools ordered (announced)
  • Global orders booked, Q3 2026: HK$8.85 billion (company-reported)

The Arizona build-out, 1975 to 2011

  • 1975: ASMPT founded
  • 1989: Listed on the Hong Kong Stock Exchange
  • 2011: Singapore became global headquarters

ASMPT Tempe office, Arizona

MeasureValueAs ofBasisSource
Address7850 S. Hardy Drive, Suite 110, Tempe, AZ 852842026-11-03company-reported From the company's own published information.ASMPT
Office roleASMPT SEMI USA, Inc., the only Americas office on the Semiconductor Solutions division's locations page2026-11-03company-reported From the company's own published information.ASMPT
AMICRA contact uses this officeASMPT AMICRA lists the Tempe office as its U.S. contact2026-11-03company-reported From the company's own published information.ASMPT

Investment

MeasureValueAs ofBasisSource
Global group revenue, Q3 2026 (continuing operations)HK$5.25 billion2026-09-30company-reported From the company's own published information.ASMPT

Production

MeasureValueAs ofBasisSource
Semiconductor Solutions rangeAssembly and packaging equipment for semiconductors, photonics and other microelectronics, from die bonding and wire bonding to encapsulation and integrated assembly systems2026-11-03company-reported From the company's own published information.ASMPT
Advanced packaging equipmentThermo-compression bonding, hybrid bonding, fan-out bonding and laser dicing systems2026-11-03company-reported From the company's own published information.ASMPT
Electronics board-assembly equipmentSMT placement and printing equipment for electronics manufacturing, including DEK and SIPLACE solutions2026-11-03company-reported From the company's own published information.ASMPT
Manufacturing softwareCritical Manufacturing, a wholly owned ASMPT subsidiary, provides manufacturing execution system (MES) software for factories2026-11-03company-reported From the company's own published information.ASMPT
Sources of Q3 2026 AI-related ordersThe company cited advanced packaging, optical transceivers and AI server-board manufacturing as drivers of group orders2026-10-28company-reported From the company's own published information.ASMPT
IBM chiplet bonding collaboration renewedASMPT and IBM agreed to advance thermo-compression and hybrid bonding methods for chiplet packages, globally2024-07-24announced From a public announcement. Plans can change.ASMPT and IBM

Other

MeasureValueAs ofBasisSource
ASM International shareholding24.55% of ASMPT's shares, held through ASM Pacific Holding B.V.2026-06-30company-reported From the company's own published information.ASMPT
Arizona registration (Arizona Corporation Commission)ASMPT SEMI USA, Inc., a Delaware corporation, active and in good standing2026-11-04verifiedArizona Corporation Commission
Former name in Arizona recordsASM Pacific Assembly Products, Inc., until October 20222026-11-04verifiedArizona Corporation Commission
ASMPT founded19752026-11-03company-reported From the company's own published information.ASMPT
Founded as a business of ASM InternationalEstablished in 1975 as the Asian marketing arm of Netherlands-based ASM International N.V.2026-11-03company-reported From the company's own published information.ASMPT
Singapore became global headquarters20112026-11-03company-reported From the company's own published information.ASMPT
Listed on the Hong Kong Stock Exchange19892026-11-03company-reported From the company's own published information.ASMPT
Announced Shenzhen manufacturing closure (2025)Closing ASMPT Equipment (Shenzhen) Co., Ltd., a Semiconductor Solutions plant in Shenzhen, China, affecting approximately 950 staff2025-08-11announced From a public announcement. Plans can change.ASMPT
NEXX disposal closedASMPT NEXX, Inc. ceased to be a subsidiary after a disposal closed June 3, 20262026-06-03company-reported From the company's own published information.ASMPT
SMT Solutions strategic reviewASMPT is assessing strategic options for its SMT Solutions segment, including a divestiture, joint venture, spin-off or public listing2026-01-21announced From a public announcement. Plans can change.ASMPT

Sources

ASMPT Jobs in Arizona (0 open)

ASMPT in Arizona: Common Questions

How do I apply for a job at ASMPT in Arizona?

Arizona AI does not currently read an online jobs board for ASMPT, so openings are best checked on the company's own website. Arizona AI does not collect applications or charge job seekers.

Where is ASMPT located in Arizona?

ASMPT SEMI USA, Inc. has an office at 7850 S. Hardy Drive, Suite 110, Tempe, Arizona 85284, the only Americas office in its Semiconductor Solutions locations directory.

What does ASMPT make?

ASMPT makes machines and software for chip assembly, advanced semiconductor packaging and assembly of electronic circuit boards. Products include die and wire bonders, thermo-compression bonders and SMT equipment.

How is ASMPT connected to artificial intelligence?

ASMPT's bonding machines are used in advanced semiconductor packaging, including packages for AI processors. In July 2026 ASMPT announced orders for more than 50 chip-to-substrate thermo-compression bonding tools from outsourced packaging and test customers.

Are ASMPT and ASM International the same company?

No. ASMPT began in 1975 as the Asian marketing arm of ASM International, and ASM International still held 24.55% of ASMPT's shares on June 30, 2026, according to ASMPT's 2026 interim report. The two are separately listed companies: ASMPT trades on the Hong Kong Stock Exchange as 0522, and ASM International has its own company profile.

Who owns ASMPT?

ASMPT Limited is a publicly traded company listed on the Hong Kong Stock Exchange as 0522. ASM International, the Dutch company ASMPT began under, held 24.55% of its shares on June 30, 2026, according to ASMPT's 2026 interim report. ASMPT's headquarters are in Singapore.