Semiconductor Packaging Integration Research Manager

This position leads Intel Foundry Technology Research efforts in advanced packaging, including chiplets, 2.5D/3D integration, hybrid bonding, wafer-level packaging, and emerging die-to-die connections. The manager sets technical roadmaps, oversees experiments and prototypes, and evaluates performance, reliability, cost, and manufacturing feasibility across package and system requirements. They coordinate researchers and partner organizations spanning design, process, materials, modeling, thermal, reliability, test, manufacturing, universities, suppliers, and foundry collaborators. The role also supports intellectual property, competitive analysis, risk reviews, and communication of strategic recommendations to senior leadership. It suits an experienced semiconductor technology leader with strong packaging integration expertise, research vision, and the ability to move exploratory concepts toward scalable manufacturing.