Quality Engineering Manager-Assembly Packaging Testing Manufacturing

This role leads end-to-end quality operations for Intel's Assembly, Packaging, Testing and Manufacturing (APTM) division across Arizona, Oregon, and New Mexico facilities. The manager oversees quality program teams, implements quality systems across multiple process technologies including wafer-level assembly and advanced packaging, and drives improvement initiatives based on root cause analysis and lessons learned from manufacturing events. The position requires extensive cross-functional partnership with suppliers, central services, and customer-facing teams to maintain quality standards and drive continuous improvement. This role suits experienced quality leaders with deep semiconductor manufacturing knowledge, strong people management capabilities, and the ability to operate effectively in complex, multi-site environments while balancing strategic roadmap development with immediate operational needs.