Module Engineer On-Shift (MEOS) – Night Shift (6)

This role supports Intel’s Substrate Packaging Technology Development team from the manufacturing floor during a 6:00 PM to 6:00 AM rotating night schedule. The engineer responds to equipment, process, and product issues, performs recovery and lot disposition activities, and assists with bringing new tools into production. Responsibilities also include shift handoffs, technical documentation, panel inspection and imaging, and communication with equipment and lot owners. The position suits an early-career engineer who is analytical, adaptable, proactive, and comfortable collaborating in a fast-paced factory environment. A relevant engineering or physical science degree is required, while experience with statistical process control or semiconductor packaging is advantageous.