Thermal Analysis Engineer

This engineer will work within Intel’s Thermal Core Comp organization on research and development for advanced assembly and packaging platforms. Responsibilities span thermomechanical and device-physics analysis, finite element and fluid-flow modeling, prototype fabrication, laboratory characterization, and process innovation. The position also involves planning experiments, applying statistical and design-of-experiments methods, and collaborating with fabrication, device, reliability, vendor, and academic partners. It suits an experienced semiconductor engineer with strong simulation, programming, experimental, and packaging expertise who can lead technical efforts and communicate results effectively. The role is based on-site in Phoenix, Arizona and focuses particularly on technologies such as EMIB and Foveros.