Arizona AIVP, Advanced Packaging Technology Lead
Amkor Technology · Tempe, AZ · Posted Sep 24, 2026
Amkor Technology is seeking a senior executive to lead the strategy, development, and commercialization of advanced IC packaging technologies for computing, networking, mobile, PC, and AI markets. The role connects customers, the Chiplets/FCBGA business, Arizona operations, and global R&D to deliver technology roadmaps and move products from development through production.