Staff EMIB-T Substrate Yield Engineer

This position leads day-to-day yield performance for assigned substrate suppliers, production lines, modules, and process areas supporting EMIB-T advanced packaging. The engineer will guide investigations from initial containment through experimentation, failure analysis, corrective actions, and long-term process control. The role works across Intel organizations and external partners to establish actions, monitor progress, support qualification and ramp activities, and strengthen analytics and dashboard capabilities. It also contributes to design-for-manufacturing and yield efforts, change control, and the transfer of lessons into future programs. This opportunity suits an experienced semiconductor or advanced packaging engineer who can independently manage complex problems, influence suppliers and cross-functional teams, and execute in a fast-moving technology development environment. The assignment requires relocation or expatriate work in Japan and does not include Intel immigration sponsorship.