Arizona AIDirector, fcCSP BU (Advanced Packaging Product Engineer)
Amkor Technology · Tempe, AZ · Posted Oct 21, 2026
Leads advanced flip-chip chip-scale package development and commercialization for Amkor’s fcCSP business, spanning technical execution, cost strategy, customer engagement, and production readiness. The role coordinates customer, factory, supplier, and sales stakeholders from early concept through qualification and launch, with emphasis on high-performance and automotive applications.