Advanced Packaging Substrate Supplier Enablement Lead

This position sits within Intel’s advanced packaging technology and manufacturing organization, focusing on supplier readiness for high-density substrates, EMIB-T, glass core, and related technologies. The successful candidate will establish process and technology transfer plans, track manufacturing readiness, and help suppliers meet quality, reliability, and capacity objectives. They will analyze production data, lead investigations into yield and quality problems, and implement corrective and continuous-improvement actions. The role requires close coordination with engineering, quality, manufacturing, and external supplier teams across global locations. It suits an experienced semiconductor or advanced-packaging professional who combines technical judgment with structured project leadership, communication, and supplier influence. Periodic evening meetings with East Asian suppliers and occasional international travel are expected.