Module Engineer On-Shift (MEOS) – Day Shift (5)

This engineer works on the factory floor supporting advanced substrate packaging production during a 12-hour day shift on an alternating three- and four-day schedule. Responsibilities include recovering process errors, managing lot disposition, supporting tool introductions, performing panel inspections and imaging, and maintaining process documentation. The role also requires clear handoffs between shifts and coordination with tool and lot owners to resolve manufacturing issues quickly. It is suited to a hands-on, detail-focused engineer who can adapt under pressure, solve problems independently, and collaborate effectively in a semiconductor production environment. Candidates should have relevant engineering or physical science education and experience with manufacturing or semiconductor tools, with packaging, SPC, recipe development, or troubleshooting experience advantageous.