Advanced Packaging Development Engineer

This engineer will join Intel’s Advanced Packaging Technology Manufacturing organization and help develop scalable packaging solutions for future computing products. The work includes designing experiments, analyzing process data, setting specifications, qualifying equipment, and resolving technical risks affecting packaging quality and reliability. The engineer will partner with manufacturing, engineering, and supplier teams while supporting both development activities and production process health. Success also requires clear technical documentation and the ability to deliver improvements on demanding schedules. The position suits an experienced STEM professional with semiconductor or manufacturing process expertise, strong analytical skills, and an interest in leading cross-functional technology development.