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Updated twice daily · Oct 16, 2026
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Senior Engineer, Technical Program Management - Advanced Packaging

This position leads complex lifecycle and change-management programs for ASM’s semiconductor equipment portfolio in Phoenix. The work includes identifying obsolescence risks, qualifying replacement components, coordinating engineering and customer approvals, and planning manufacturing transitions. The role partners across technical, operational, commercial, and supplier organizations while managing cost, quality, risk, and timing. It is well suited to an experienced program manager or engineer with strong semiconductor or high-tech manufacturing expertise, lifecycle management knowledge, and the ability to influence teams without direct authority. Some travel to suppliers, manufacturing locations, and customer sites may be required.

Requirements

Bachelor’s degree in an engineering or related technical discipline8+ years in technical program management, PLM, sustaining engineering, operations engineering, or supply chain engineeringExperience leading complex cross-functional programs in semiconductor equipment, electronics, or high-tech manufacturingExpertise in component obsolescence, EOL/PCN/PDN processes, qualification planning, and supply continuityExperience with engineering changes, configuration management, and BOM governanceStrong stakeholder leadership, risk management, and executive communication skills
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Listed October 8, 2026 · Verify details with the employer before applying.

About ASM International

Dutch chip-equipment maker developing ALD and epitaxy tools in Phoenix; its Scottsdale campus, under construction in mid-2026, is planned to open in early 2027.

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