Packaging Module Development Engineer

This engineer will work within Intel’s Advanced Packaging Technology Manufacturing organization, connecting manufacturing equipment, measurement systems, software, and process data. Responsibilities include developing Python or C# applications, maintaining software through its full lifecycle, creating data pipelines and SQL-based analyses, and optimizing inspection recipes. The role also involves experiments, measurement-system studies, statistical process control, hardware characterization, and resolving issues involving sensors, drivers, communications, and metrology tools. The engineer will partner with equipment suppliers and internal teams to improve tool performance and implement corrective actions. It suits an experienced STEM professional who enjoys solving ambiguous problems across hardware, software, analytics, and semiconductor manufacturing and can lead technical projects independently.