Development Reliability Staff Engineer

Based in Scottsdale, Arizona, this engineer will work across fabrication, packaging, product engineering, manufacturing, and business teams to guide reliability decisions for silicon, SiC, and GaN devices and power modules. The position involves defining new-product reliability requirements, evaluating advanced package technologies, investigating electro-thermo-mechanical failure mechanisms, and improving designs, materials, or processes. It also leads power and thermal cycling programs, develops lifetime models, supports FMEA and corrective actions, and connects accelerated test results with real-world customer mission profiles. Success requires clear communication with both technical and nontechnical audiences, including direct engagement with customers and internal stakeholders. This opportunity suits an experienced reliability professional with advanced engineering education, strong semiconductor packaging knowledge, and the ability to lead several cross-functional projects in a fast-moving environment.