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Module Engineering - Day Shift 5 or 7
This engineer will help create manufacturable packaging processes, specify equipment and materials, and improve production performance across quality, yield, cost, reliability, and productivity measures. The position supports technology evaluation through environmental and mechanical testing and develops methods to identify packaging risks early. It also involves using statistical analysis and experimental design to troubleshoot issues, standardize qualification and quality practices, and guide design and material decisions. The engineer will work with manufacturing, development, procurement, supplier quality, contract assemblers, and foundry customers. This opportunity suits an early-career engineer with a STEM degree and experience in SPC or DOE who is interested in semiconductor manufacturing and packaging reliability.
Requirements
Listed October 12, 2026 · Verify details with the employer before applying.
About Intel
Chipmaker that has manufactured in Arizona since 1979. Its Chandler Fab 52 makes chips on Intel 18A, the most advanced node made in the U.S., Intel says.
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