Packaging Module Equipment Development Engineer

This engineer will help create and improve packaging equipment, process flows, and material specifications so products meet performance, yield, cost, quality, and manufacturability goals. The work includes using DOE and SPC, assessing design manufacturability, developing early quality and reliability screening methods, and investigating failure risks. The engineer will collaborate with technology teams, procurement, supplier quality organizations, contract manufacturers, and external vendors. The position is part of Intel’s Packaging Module Development function and supports projects from initial development through high-volume production and global standardization. It suits a recent STEM graduate who enjoys structured problem solving, hands-on factory or laboratory work, and coordinating complex technical projects.