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Updated twice daily · Oct 27, 2026
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Packaging Module Equipment Development Engineer

IntelPhoenix, AZ$133,800.00-$188,890.00 USD annually

This engineer will develop and optimize packaging operations involving materials, tooling, and equipment such as dispense, molding, and curing systems. The position combines hands-on laboratory and factory work with reliability evaluation, statistical analysis, experimentation, and data-driven troubleshooting. It also involves coordinating suppliers, contract manufacturers, procurement, and quality teams while guiding technology transfers and global process standardization. The role suits an engineer with semiconductor manufacturing experience who can lead cross-functional projects, solve complex technical problems, and communicate effectively in a matrixed organization. A STEM degree and experience using SPC or DOE, managing equipment or quality systems, and validating process improvements are required.

Requirements

Bachelor’s, master’s, or PhD in a relevant STEM engineering disciplineRelevant semiconductor industry experience based on degree levelExperience applying SPC or DOE in high-tech manufacturingExperience with technical change control, equipment sustaining, or quality data systemsStructured, data-driven problem-solving and validation skillsPreferred: packaging process or equipment experience with dispense, mold, or cure technologies
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Listed October 27, 2026 · Verify details with the employer before applying.

About Intel

Chipmaker that has manufactured in Arizona since 1979. Its Chandler Fab 52 makes chips on Intel 18A, the most advanced node made in the U.S., Intel says.

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