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Packaging Module Equipment Development Engineer
This engineer will develop and optimize packaging operations involving materials, tooling, and equipment such as dispense, molding, and curing systems. The position combines hands-on laboratory and factory work with reliability evaluation, statistical analysis, experimentation, and data-driven troubleshooting. It also involves coordinating suppliers, contract manufacturers, procurement, and quality teams while guiding technology transfers and global process standardization. The role suits an engineer with semiconductor manufacturing experience who can lead cross-functional projects, solve complex technical problems, and communicate effectively in a matrixed organization. A STEM degree and experience using SPC or DOE, managing equipment or quality systems, and validating process improvements are required.
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Listed October 27, 2026 · Verify details with the employer before applying.
About Intel
Chipmaker that has manufactured in Arizona since 1979. Its Chandler Fab 52 makes chips on Intel 18A, the most advanced node made in the U.S., Intel says.