TD Media and Collaterals Development Engineer

This engineer will join Intel’s Media Development organization, which supports advanced packaging technologies and semiconductor manufacturing operations. The work includes designing new media and collateral solutions, applying DOE and SPC methods, and testing designs under environmental and mechanical conditions that simulate field use. The role also involves assessing risks, troubleshooting technical issues, advising operational teams, and aligning improvements with manufacturing and technology milestones. Successful candidates will document innovations through technical presentations and research publications. It suits a mechanically oriented engineer with hands-on equipment, design, or process experience, especially someone familiar with CAD tools and semiconductor packaging.