ADCE Packaging Design Architect

The engineer will own substrate design activities, including feasibility studies, routing, design-rule definition, design reviews, data analysis, and resolution of design-rule violations. This position works across silicon, hardware, and packaging teams to balance technical performance, manufacturability, and cost. It also requires maintaining design documentation and lifecycle records while supporting package verification and optimization. The role suits an experienced electrical, mechanical, chemical, or materials engineer with deep semiconductor packaging, PCB, or IC design expertise. Strong analytical judgment, independence, communication skills, and proficiency with industry design and simulation platforms are important for success.