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Updated daily · Sep 11, 2026
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Substrate Quality and Reliability Engineer

IntelPhoenix, AZ$103,730.00-$198,820.00 USD annually

This engineer will guide substrate capacity expansion and help shape packaging and assembly technology decisions from development through high-volume manufacturing. The work includes setting quality and reliability standards, defining inspection and test strategies, modeling reliability risks, and supporting product qualification milestones. The position operates across materials, process, supplier, packaging, and manufacturing teams to improve process maturity and prevent customer-impacting failures. It also involves responding to quality events and recommending specification, process, or formulation changes based on technical evidence. The role suits an experienced materials or engineering professional who is comfortable with statistical analysis, ambiguity, and influencing cross-functional teams in an onsite-focused manufacturing environment.

Requirements

Master’s degree with 2+ years of industry experience or PhD in a relevant engineering or science discipline2+ years in substrate manufacturing, semiconductor fabrication, package assembly, wafer processing, or board/system integrationExperience collaborating across cross-functional engineering teamsBackground in reliability statistics, statistical analysis, or design of experimentsKnowledge of materials, manufacturing processes, package technology, or accelerated life testingProgramming or scripting skills for data analysis, such as Python or SQL
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Listed September 11, 2026 · Verify details with the employer before applying.

About Intel

Four decades of chip manufacturing in Chandler, with the Ocotillo campus among Intel's largest fab sites and ongoing expansion.

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