Mechanical Design Engineer - Semiconductor Packaging

The Mechanical Design Engineer will lead mechanical design activities for Intel's semiconductor packaging operations, developing detailed CAD models and technical specifications for components ranging from tape and reel packaging to complex assemblies like integrated heat spreaders and process trays. Working within a cross-functional environment that includes architecture, process, and assembly teams, this engineer will be the primary point of contact for all packaging mechanical design needs and must balance competing priorities while maintaining high precision standards. The ideal candidate combines strong technical CAD skills with proactive problem-solving abilities and excellent communication, capable of identifying design and manufacturing issues early and driving solutions with minimal oversight. This position suits engineers who thrive in collaborative settings, enjoy working on tangible products within advanced manufacturing, and are committed to continuous improvement in a fast-paced semiconductor environment.