Mechanical Design Engineer - Semiconductor Packaging

This engineer will develop and document designs for items such as tape-and-reel systems, substrates, heat spreaders, stiffeners, package assemblies, and process trays. The position serves as a central design contact for packaging collateral and works with architecture, process, and assembly groups to ensure designs can be manufactured effectively. Success requires managing several projects, meeting deadlines, and addressing design or process issues with limited oversight. The role is based onsite in Phoenix, Arizona, and would suit an early-career mechanical engineer with CAD experience and an interest in semiconductor packaging or precision manufacturing. Strong communication, spatial reasoning, drawing interpretation, and practical mechanical design skills are important.