Substrate Supplier Enablement Engineer

This position sits within Intel’s Advanced Packaging Technology Development organization and focuses on expanding reliable manufacturing capacity through substrate supplier enablement. The engineer will guide process development, validation, certification, and qualification across complex substrate manufacturing steps while improving yield and managing process interactions. They will track supplier commitments, readiness schedules, and ramp indicators to support timely and stable production launches. Success requires close collaboration with supplier engineering groups and cross-functional teams across the United States and East Asia, including periodic travel. The role suits an experienced packaging, semiconductor manufacturing, or process engineer who can lead complex programs, apply statistical problem-solving methods, and drive execution in ambiguous global environments.