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Updated daily · Sep 19, 2026
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Packaging Research and Development Engineer

IntelPhoenix, AZ$133,800.00-$188,890.00 USD annually

This engineer will create equipment setups, process specifications, and integrated manufacturing flows for emerging substrate packaging technologies. They will use designed experiments, statistical methods, and materials or equipment studies to define process windows and resolve interactions that affect production. The position also focuses on improving yield, reliability, quality, cost, automation, stability, and manufacturing productivity. Working with cross-functional engineering teams and external suppliers, the engineer will help advance first-of-a-kind packaging capabilities from development toward scalable factory operation. It suits an experienced materials, mechanical, chemical, physics, or related engineering professional who enjoys hands-on troubleshooting, applied research, ambiguity, and collaboration in an on-site manufacturing environment.

Requirements

Master’s degree with 3+ years of related experience or PhD with 1+ yearBackground in mechanical or materials engineering and advanced packagingExperience with semiconductor, substrate, embedded-die, or heterogeneous integration developmentExpertise in DOE, statistical analysis, process optimization, and root-cause investigationAbility to work with process equipment, factory operations, and equipment suppliersStrong communication, teamwork, analytical, and troubleshooting skills
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Listed September 10, 2026 · Verify details with the employer before applying.

About Intel

Four decades of chip manufacturing in Chandler, with the Ocotillo campus among Intel's largest fab sites and ongoing expansion.

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