TD Media and Collaterals Development Engineer

This engineer will create and improve media, tooling, and related collateral for Intel’s future assembly and packaging technologies. The work includes defining specifications, designing experiments, analyzing process data, building evaluation equipment, and developing accelerated tests for conditions such as heat, humidity, vibration, and temperature cycling. The engineer will also support material and prototype decisions, identify reliability risks early, document technical findings, and help standardize qualification and manufacturing methods. The position works closely with packaging technology, manufacturing, and partner engineering teams to advance products toward key milestones and address customer or process needs. It suits an early-career mechanical, materials, electrical, or physics engineer with strong experimental, analytical, and semiconductor manufacturing interests who can work onsite in Phoenix, Arizona.