TD Media and Collaterals Development Engineer

The TD Media and Collaterals Development Engineer designs and enhances materials and equipment specifications for Intel's assembly and packaging operations, focusing on improving manufacturing efficiency and product reliability. The engineer conducts design experiments, develops testing methodologies to simulate real-world conditions, and collaborates with cross-functional teams to solve complex technical challenges and meet product milestones. This position requires deep expertise in failure analysis, material science, and manufacturing processes, with responsibilities spanning from prototype development through standardization and customer consultation. The role suits engineers who combine strong analytical and design skills with hands-on experience in semiconductor assembly or related manufacturing environments, and who thrive in a collaborative, innovation-focused setting working toward advancing semiconductor packaging technology.