Package Failure Analysis Engineer

This engineer will support Intel Foundry’s packaging and assembly operations by analyzing failures, characterizing defects, and determining mechanisms behind yield problems. Working on-site in a lab environment, the role involves planning data collection, conducting engineering tests, using specialized analytical equipment, and communicating findings to manufacturing and program partners. The engineer will coordinate with technicians, yield teams, integration groups, module partners, and customers to address priorities and deliver corrective actions. The position suits an early-career engineering or physical sciences graduate who is comfortable with hands-on investigations, ambiguity, changing priorities, and collaborative problem solving. U.S. citizenship and eligibility for a TS/SCI clearance with polygraph are required.