Package Failure Analysis Engineer

The Package Failure Analysis Engineer supports Intel's manufacturing operations by conducting root cause analysis on assembled package defects and in-line failures using various fault isolation and characterization techniques. This is a lab-based, on-site role within Intel Foundry's manufacturing function where the engineer performs hands-on analysis work, develops innovative failure analysis approaches, and provides technical consultation to internal teams and customers. The position requires collaboration across organizational boundaries with shift technicians, program partners, and yield support teams while working a compressed week schedule. This role suits engineers with strong analytical and problem-solving skills who are comfortable with ambiguity, possess lab experience with advanced analytical equipment, and can communicate technical findings effectively in a fast-paced semiconductor manufacturing environment. The engineer will be responsible for fault isolation of electrical failures, process characterization, and recommending corrective actions that drive yield improvements and manufacturing innovation. US citizenship and the ability to obtain a government security clearance are required.