Packaging Module Engineer

This engineer will develop packaging materials and processes from early concepts through prototypes, testing, qualification, and technical documentation. The position supports Intel’s packaging and manufacturing functions by coordinating with supply chain, logistics, regulatory, marketing, and external suppliers to ensure shipment-ready solutions. Responsibilities also include risk analysis, vendor evaluation, benchmarking, and improvements to packaging efficiency, sustainability, and scalability. The role suits an engineer with experience in packaging assembly, production methods, process control, experimentation, and manufacturing-oriented design. Candidates who can lead cross-functional technical work, analyze data, and apply semiconductor packaging knowledge in a fast-paced environment may be especially well suited.