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Updated daily · Sep 19, 2026
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Package Failure Analysis Engineer

IntelPhoenix, AZ$85,200.00-$139,810.00 USD

This engineer will support Intel Foundry manufacturing by identifying root causes of package and assembly failures and helping improve production yield. The work involves planning data collection, conducting laboratory analyses and engineering tests, characterizing defects and processes, and recommending corrective actions to internal stakeholders. The position partners with technicians, yield and integration teams, module groups, program customers, and other engineers to address priorities and manufacturing events. It is suited to an early-career engineer with a relevant technical degree, practical failure-analysis or laboratory experience, strong problem-solving ability, and the flexibility to work in an ambiguous, fast-moving environment. The role is fully on-site in Phoenix and requires a Thursday-through-Saturday plus alternating Wednesday day schedule.

Requirements

Bachelor’s degree or higher in an engineering, chemistry, physics, or related disciplineU.S. citizenshipAbility to obtain and maintain a TS/SCI clearance with polygraphHands-on experience with electrical fault isolation or defect characterizationStrong analytical, communication, and presentation skillsAbility to work collaboratively on an on-site compressed shift
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Listed August 20, 2026 · Verify details with the employer before applying.

About Intel

Four decades of chip manufacturing in Chandler, with the Ocotillo campus among Intel's largest fab sites and ongoing expansion.

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