ATD Laser Development Engineer

As a Packaging Module Development Engineer in Laser Assembly, you'll lead the design and optimization of laser assembly processes and equipment that enable Intel's advanced semiconductor packaging solutions. This role sits within Intel's packaging technology function and requires you to apply statistical methods and data analysis to develop robust manufacturing processes that meet quality, yield, and cost targets. You'll work across multiple teams to establish laser process specifications, innovate quality screening techniques, and drive standardization in manufacturing procedures. This position suits engineers with strong backgrounds in physics or mechanical engineering who have hands-on experience in semiconductor or electronics manufacturing environments and want to contribute to cutting-edge packaging innovation.