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Updated daily · Sep 12, 2026
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ATD Experienced Laser Development Engineer

IntelPhoenix, AZFull-time$115,110.00-$219,550.00 USD

This engineer will help create and qualify laser packaging technologies, define process and equipment specifications, and ensure designs can be manufactured reliably at scale. The work includes using statistical methods, failure analysis, and data-driven experimentation to optimize processes and identify quality or reliability risks early. The engineer will also partner with suppliers and internal engineering teams on materials, equipment, qualification standards, and production milestones. The position is part of Intel’s semiconductor packaging and assembly development function and is based on-site in Phoenix, Arizona. It suits an experienced physics, mechanical, optical, or related STEM professional with hands-on manufacturing or semiconductor packaging expertise and strong analytical skills.

Requirements

Bachelor's degree in Physics, Mechanical Engineering, Optical Engineering, or related STEM field with 4+ years industry experience (or Master's with 3+ years, or PhD with 6+ months)Proficiency in Statistical Process Control, Design of Experiments, and process characterization techniquesStrong analytical skills with expertise in data analysis, risk assessment, and problem-solvingHands-on experience in technology manufacturing or semiconductor packaging with laser-based equipment troubleshootingExperience applying engineering principles to develop innovative laser solutions for packagingAbility to collaborate across teams and deliver results in time-sensitive projects
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Listed July 24, 2026 · Verify details with the employer before applying.

About Intel

Four decades of chip manufacturing in Chandler, with the Ocotillo campus among Intel's largest fab sites and ongoing expansion.

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