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ATD Experienced Laser Development Engineer
This engineer will help create and qualify laser packaging technologies, define process and equipment specifications, and ensure designs can be manufactured reliably at scale. The work includes using statistical methods, failure analysis, and data-driven experimentation to optimize processes and identify quality or reliability risks early. The engineer will also partner with suppliers and internal engineering teams on materials, equipment, qualification standards, and production milestones. The position is part of Intel’s semiconductor packaging and assembly development function and is based on-site in Phoenix, Arizona. It suits an experienced physics, mechanical, optical, or related STEM professional with hands-on manufacturing or semiconductor packaging expertise and strong analytical skills.
Requirements
Listed July 24, 2026 · Verify details with the employer before applying.
About Intel
Four decades of chip manufacturing in Chandler, with the Ocotillo campus among Intel's largest fab sites and ongoing expansion.