Packaging Module Development Engineer

This engineer will work within Intel Foundry’s advanced packaging organization to develop and scale assembly modules from early concept through high-volume manufacturing. Responsibilities include defining and qualifying equipment, improving materials and fabrication processes, and balancing quality, reliability, cost, yield, productivity, and manufacturability. The role also provides sustaining support for production equipment and responds to customer issues and manufacturing escalations. Success requires technical leadership, analytical problem-solving, communication, adaptability, and the ability to influence teams across a matrixed organization. It suits a graduate-level engineer with semiconductor, process-development, or equipment experience and practical programming exposure involving AI or machine-learning methods.