Foveros Direct Pathfinding Integration

This position supports Intel Foundry’s advanced packaging technology efforts by applying engineering and materials expertise to packaging design, process development, and qualification. The work spans thermal, mechanical, and electrical considerations, along with testing, specifications, material certification, manufacturability, cost, sustainability, and supply-chain performance. The engineer will coordinate with manufacturing, suppliers, logistics, regulatory, marketing, and other stakeholders to enable product launches and production scale-up. Experience with hybrid bonding or Foveros Direct integration would be especially relevant to the role’s pathfinding focus. It suits a senior engineer with a strong semiconductor packaging background who can lead technology programs and drive improvements across organizational boundaries.