Packaging Module Development Engineer

This engineer works within Intel’s packaging technology and manufacturing development function to advance assembly platforms and prepare products for production. Responsibilities include designing experiments, analyzing process data, improving yield and productivity, qualifying materials and equipment, and ensuring package designs can be manufactured reliably and economically. The role also investigates failure mechanisms, develops accelerated reliability tests and quality screens, and coordinates with suppliers, procurement, quality teams, and partner engineering groups. It suits a technically experienced PhD-level engineer with a background in semiconductor packaging, materials, mechanical or electrical engineering, or a related discipline. Candidates should be comfortable solving complex problems with statistical methods and working onsite in a collaborative, hands-on environment.