Thermal Quality and Reliability Engineer

This engineer will establish quality standards, inspection methods, metrology plans, and reliability approaches for semiconductor packaging technologies. The work spans technology development and manufacturing, including environmental testing, wearout analysis, failure-risk modeling, and investigation of production quality issues. The engineer will support packaging maturity by creating improved qualification methods, acceleration techniques, analytical tools, and standardized manufacturing practices. The position is part of Intel Foundry’s global manufacturing and packaging organization and involves working with internal groups and external partners to meet product milestones. It suits a doctorate-level engineer or scientist with semiconductor packaging experience, strong statistical and problem-solving abilities, and an interest in influencing complex cross-functional programs.