Thermal Quality and Reliability Engineer

As a Packaging Quality and Reliability Engineer, you'll be responsible for establishing and maintaining quality standards for Intel's advanced semiconductor packaging components. Working within the Intel Foundry division, you'll develop inspection protocols, create reliability models through statistical analysis, and evaluate how materials and processes perform under real-world conditions like temperature and humidity extremes. This position sits at the intersection of technology development and manufacturing, requiring you to identify quality risks, respond to production issues, and innovate testing methods for new packaging processes. You'll work closely with cross-functional teams across the organization to ensure packaging meets customer specifications and product milestones. This role is ideal for engineers with advanced degrees in mechanical or materials science who are passionate about semiconductor manufacturing excellence and want to make tangible impacts on product quality.