Package Assembly Process Development Integration Engineer

This engineer will guide package assembly development from data collection and design-of-experiment planning through process qualification, specification validation, and yield improvement. Working within Intel’s Arizona Package Assembly Development Integration team, the role coordinates cross-functional stakeholders, leads technical working groups, and addresses risks affecting advanced packaging products. Responsibilities include managing materials and substrates, evaluating die-package and process interactions, and developing practical wafer-level, assembly, and substrate solutions. The position suits an engineer with semiconductor or manufacturing experience who can apply statistical methods and characterization data to complex process problems. Strong communication, collaboration, technical judgment, and a willingness to work across organizational boundaries and travel occasionally are important for success.