ATD MIHL Equipment Development Engineer

As a Packaging Module Development Engineer on Intel's Packaging Module Development team, you will design advanced equipment and refine manufacturing processes that support next-generation semiconductor packaging solutions. Your responsibilities include applying Design of Experiments and statistical methods to optimize processes, designing equipment for reliability testing under various environmental conditions, defining material specifications, and leading problem-solving initiatives to improve quality and manufacturability. This role suits experienced engineers with strong mechanical design and process optimization expertise who are passionate about semiconductor manufacturing innovation and want to directly impact Intel's technological advancement across its product portfolio.