ATD MIHL Equipment Development Engineer

This engineer will join Intel’s Packaging Module Development organization, which develops assembly and packaging technologies for future products. Responsibilities include designing equipment for reliability testing, optimizing processes with statistical methods, defining material and manufacturing specifications, and improving production workflows. The position requires collaboration with design, manufacturing, procurement, supplier quality, and other technical teams to resolve packaging challenges and manage qualification risks. It also involves establishing reliability standards, documenting technical findings, and leading continuous improvement efforts. It suits a mechanical, materials, or related STEM professional with semiconductor or precision manufacturing experience and the ability to manage complex engineering projects.