Packaging Module Equipment Development Engineer

This engineer will work within Intel’s Packaging Module Development organization to create, optimize, and qualify equipment and assembly processes used in high-volume semiconductor manufacturing. The position applies statistical analysis, DOE, and SPC to investigate process performance, close equipment gaps, and document technical conclusions. Responsibilities span equipment health, manufacturability, new materials and package architectures, reliability, quality systems, and continuous improvement from development through production. The engineer will partner with cross-functional teams and lead responses to technical risks and manufacturing challenges tied to product milestones. It suits a mechanical, materials, metallurgical, or related STEM professional with semiconductor packaging or manufacturing experience who enjoys hands-on problem solving and technical project leadership.