Packaging Module Development Engineer

This engineer will develop and characterize advanced packaging assembly processes, using methods such as Design of Experiments and Statistical Process Control to guide improvements. The position partners with manufacturing, engineering, equipment, materials, and supplier teams to manage technical risks and establish effective process and equipment standards. It also provides support for both development programs and high-volume manufacturing, with responsibilities for documenting results and promoting consistency across Intel sites. The role suits an early-career STEM graduate who enjoys hands-on semiconductor process work, data-driven problem solving, collaboration, and continuous learning. Experience with packaging, equipment qualification, data analysis, programming, machine vision, or automated inspection would be advantageous.