Packaging Module Development Engineer

This engineer will develop, qualify, and improve advanced packaging modules for high-volume semiconductor production. The work includes designing process specifications, configuring equipment, running experiments, analyzing process data, and resolving issues with cross-functional partners and suppliers. The engineer will also support material standards, manufacturing qualification, equipment performance, technical documentation, and global process consistency. The position sits within Intel’s Substrate Packaging Technology Development organization and contributes to packaging solutions used across computing and mobile products. It is suited to a recent PhD graduate in a relevant STEM discipline who combines strong analytical skills with curiosity, initiative, and effective collaboration.