Staff Board - Package co-design Engineer

This engineer will work with globally distributed packaging, silicon, board, and program teams to assess package-to-PCB integration and shape practical SoC and platform designs. Responsibilities include evaluating pinouts, breakout and routing strategies, PCB stackups, manufacturability, cost, timing, and system-level feasibility. The position requires strong knowledge of high-speed interfaces such as PCIe and LPDDR, escape routing for dense devices, and signal and power integrity across both packages and boards. The engineer will also contribute to early architecture decisions involving placement, form factor, power delivery networks, and layout constraints, using tools such as OrCAD and Allegro. It suits an experienced electronics or hardware professional who can influence cross-functional decisions, communicate clearly across regions, and manage complex technical trade-offs.