Packaging Module Development Engineer

The Packaging Module Development Engineer works within Intel's Assembly Technology Development team to advance semiconductor packaging capabilities for next-generation computing platforms. The engineer develops interconnect and thermal solutions, manages equipment development from concept through high-volume manufacturing, and optimizes assembly processes for quality, reliability, cost, and yield. This position requires cross-functional collaboration with manufacturing, design, and foundry teams to innovate equipment, materials, and processes at scale. The role suits individuals with advanced engineering degrees, manufacturing systems experience, and strong technical leadership abilities who can operate independently in a complex, matrixed organization while managing multiple project priorities.