Packaging Module Development Engineer

This engineer will work within Intel’s advanced packaging organization to develop packaging modules and the equipment and processes needed to manufacture them reliably at scale. Responsibilities span early technology exploration, equipment definition and selection, process optimization, project execution, and ongoing support for production performance. The role requires close collaboration with engineering, manufacturing, foundry, and customer-facing teams while balancing quality, yield, cost, reliability, and schedule objectives. It suits a technically strong engineer who enjoys experimental work, solving ambiguous problems, influencing across organizational boundaries, and developing other technical professionals. Regular onsite participation is expected in the Phoenix, Arizona area, with the posting also describing eligibility for Intel’s hybrid work model.