Principal Collateral Device Engineer

The Principal Collateral Device Engineer drives the creation of next-generation device and interconnect technology by designing test chips, optimizing design rules, and developing process monitoring structures for advanced semiconductor nodes. This position sits within Intel's Manufacturing Development and Customer Engineering organization, which is central to Intel's transformation into a foundry service provider. The role requires deep expertise in CMOS device physics, design rule optimization, and data analysis to translate process development into manufacturable solutions that serve both internal teams and external foundry customers. You will lead cross-functional collaborations spanning process integration, yield engineering, device physics, and design teams to solve complex technical challenges in a fast-paced manufacturing environment. This position suits experienced semiconductor engineers who combine strong technical problem-solving with leadership capability and a desire to influence innovation across diverse global teams.