Advanced Packaging Reliability Lab Engineer

This engineer will join Intel’s Stress Testing and Reliability Laboratory within the Environmental Stress Tool Engineering team. They will support test systems that expose silicon and packages to thermal, temperature, and humidity stresses, helping evaluate technologies such as EMIB, Foveros, Hybrid Bonding, and Co-Packaged Optics. The work includes equipment characterization, calibration, statistical process control, fixture and tool development, issue response, and coordination with vendors and site support teams. The position suits an experienced electrical or related scientific engineer who enjoys hands-on laboratory work, instrumentation, automation, and reliability analysis. Strong candidates will be comfortable troubleshooting DC power and measurement systems while collaborating across operations, facilities, planning, and technology development groups.