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Advanced Packaging Reliability Lab Engineer
This role supports the development and operation of environmental stress testing equipment used to validate Intel's cutting-edge packaging technologies under thermal, temperature, and humidity extremes. You'll work hands-on with DC power systems, measurement instrumentation, and data acquisition equipment to characterize equipment performance, improve testing methods, and translate reliability requirements into innovative testing solutions. The position bridges engineering analysis with practical system implementation, requiring collaboration across vendor coordination, operations, and internal teams. This opportunity suits engineers who enjoy troubleshooting complex electrical systems, have strong fundamentals in DC electronics and instrumentation, and want to contribute directly to Intel's foundry manufacturing advancement through reliability validation.
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Listed July 13, 2026 · Verify details with the employer before applying.
About Intel
Four decades of chip manufacturing in Chandler, with the Ocotillo campus among Intel's largest fab sites and ongoing expansion.
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