Packaging Technical Program Manager

The Packaging Technical Program Manager leads strategic programs that support Intel Foundry's manufacturing quality systems, advanced packaging readiness, and phase gate execution across multiple operational domains. You'll manage the complete program lifecycle from planning through implementation, testing, and closeout while maintaining visibility into schedule, costs, risks, and quality metrics. This role requires operating as a bridge between technical teams, manufacturing operations, suppliers, and executive stakeholders, translating complex requirements into actionable plans and clear accountability structures. You'll drive process improvements through quality automation, dashboards, and systemic enhancements while identifying risks early and maintaining execution discipline in a fast-paced, multi-site environment. The position suits technically strong leaders with program management experience who excel at navigating ambiguity, influencing across organizational boundaries, and delivering measurable business outcomes in semiconductor or manufacturing contexts.