Skip to main content
Updated daily · Sep 12, 2026
All open roles

Open role

Packaging Technical Program Manager

IntelPhoenix, AZFull-time$120,320.00-236,810.00 USD

This position manages technical and operational programs from initial planning through implementation, validation, training, closeout, and continuous improvement. It works across packaging, manufacturing, quality, suppliers, automation, central services, and customer-facing teams to align requirements, ownership, schedules, and deliverables. The program manager will provide leadership visibility through dashboards, milestones, quality measures, risk reviews, and recovery plans while driving timely decisions and accountability. The role suits an experienced leader with a background in semiconductor packaging, manufacturing, quality, engineering, or operations who can influence diverse stakeholders without direct authority. Strong candidates are structured, technically capable, comfortable with ambiguity, and effective communicating with both working teams and executives.

Requirements

Bachelor's degree in engineering, Technology, Operations, Program Management, or related discipline7+ years in packaging technology, manufacturing, quality, engineering, operations, or project/program managementDemonstrated leadership of complex, cross-functional projects with measurable outcomesAbility to lead through influence across manufacturing, quality, supplier, and customer-facing organizationsStrong project planning, risk management, stakeholder communication, and execution skillsPreferred: Experience in APTM, semiconductor manufacturing, advanced packaging, or supplier quality initiatives
Apply for this role

Listed July 24, 2026 · Verify details with the employer before applying.

About Intel

Four decades of chip manufacturing in Chandler, with the Ocotillo campus among Intel's largest fab sites and ongoing expansion.

More roles at Intel

In the news