Open role
Module Engineering - Day Shift 5 or 7
As a Module Engineer in Intel's Foundry Technology Manufacturing unit, you will drive the development and optimization of semiconductor packaging assembly processes and equipment. Your work spans process design, manufacturing efficiency improvements, equipment specification, and reliability testing to ensure foundry packages meet stringent customer requirements. You'll partner with suppliers, lead continuous improvement initiatives, and serve as a technical consultant for packaging challenges across the organization. This role suits engineers with a strong foundation in mechanical, materials, chemical, or electrical engineering who are eager to work at the intersection of design and manufacturing, and who want to impact the quality of next-generation semiconductor products used globally.
Requirements
Listed July 21, 2026 · Verify details with the employer before applying.
About Intel
Four decades of chip manufacturing in Chandler, with the Ocotillo campus among Intel's largest fab sites and ongoing expansion.
More roles at Intel
- Packaging Module Development EngineerUS, Arizona, Phoenix
- FSMS Product Owner
- Commodity Manager
- Ocotillo Technology Fabrication DSIRE (Diffusion) Module EngineerUS, Arizona, Phoenix
- System Software EngineerUS, Arizona, Phoenix