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Module Engineering - Day Shift 5 or 7

IntelUS, Arizona, PhoenixFull-time$85,200.00-$162,500.00 USD

As a Module Engineer in Intel's Foundry Technology Manufacturing unit, you will drive the development and optimization of semiconductor packaging assembly processes and equipment. Your work spans process design, manufacturing efficiency improvements, equipment specification, and reliability testing to ensure foundry packages meet stringent customer requirements. You'll partner with suppliers, lead continuous improvement initiatives, and serve as a technical consultant for packaging challenges across the organization. This role suits engineers with a strong foundation in mechanical, materials, chemical, or electrical engineering who are eager to work at the intersection of design and manufacturing, and who want to impact the quality of next-generation semiconductor products used globally.

Requirements

US Citizenship requiredBachelor's degree in Mechanical Engineering, Materials Science, Chemical Engineering, Electrical Engineering, or STEM field (or Master's degree, or Associate degree with 12+ years engineering experience)6+ months experience with Statistical Process Control (SPC) and/or Design of Experiments (DOE)Experience in technology or semiconductor manufacturing environment (preferred)Background in semiconductor packaging processes, assembly, materials, or reliability engineering (preferred)Ability to work compressed day shift schedules (6 AM - 6 PM, Sunday-Tuesday or Thursday-Saturday)
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Listed July 21, 2026 · Verify details with the employer before applying.

About Intel

Four decades of chip manufacturing in Chandler, with the Ocotillo campus among Intel's largest fab sites and ongoing expansion.