Module Engineering - Day Shift 5 or 7

Working within Intel Foundry Technology Manufacturing, the engineer will connect packaging technology development with production execution by designing processes, equipment, specifications, and manufacturing workflows. The role uses experimentation, statistical analysis, reliability testing, and failure-mechanism knowledge to improve package performance and identify risks early. Responsibilities also include supporting equipment used for environmental and mechanical testing, establishing material and supplier standards, and ensuring package designs can be manufactured consistently. The engineer will lead continuous improvement, troubleshooting, standardization, and technical consultation for internal partners, contract assemblers, vendors, and foundry customers. This opportunity suits an early-career STEM engineer with interest in semiconductor packaging, manufacturing, process development, reliability, and data-driven problem solving.