Director – PDK Architecture

The Director will define PDK scope, architecture, specifications, quality standards, and technology roadmaps across logic, memory, analog, physical implementation, reliability, and packaging domains. They will lead readiness reviews and signoffs, resolve technical gaps, and ensure process requirements become complete and executable PDK deliverables. A major focus is advancing 3DIC, chiplet, system-in-package, and heterogeneous integration enablement through future-oriented PDK and 3DK architectures. The position leads globally distributed teams and collaborates with technology development, PDK development, infrastructure, quality, program management, customers, and EDA companies. It suits an experienced semiconductor or design-enablement leader who combines strong technical depth with executive communication, organizational influence, and program execution skills.