Principal Engineer - Board/Package Co-design

This Principal Engineer will help develop physical hardware platforms that showcase Arm SoCs, working across board design, chip packaging, and system architecture. The position involves influencing pinouts, breakout and routing strategies, stackups, power delivery, manufacturability, cost, and performance from the earliest design stages. It requires close collaboration with geographically distributed SoC, architecture, packaging, platform, fabrication, and manufacturing teams, as well as clear communication of technical decisions and schedules. The role suits an experienced electronics or hardware architect with deep expertise in high-speed interfaces, dense board design, package integration, and signal and power integrity. It is particularly well matched to someone comfortable making progress in complex, changing programs and influencing decisions across organizational boundaries.