Quality Reliability Engineer

This engineer will define and execute reliability programs for technologies such as BGA, LGA, flip-chip, chiplet, and other advanced package designs. Responsibilities include planning environmental and mechanical tests, setting acceptance criteria, investigating failures, and driving corrective actions with design, manufacturing, supplier, and customer teams. The role also uses methods such as FMEA, Weibull analysis, DOE, and reliability growth to evaluate risks and support technical decisions. As a company representative in organizations including JEDEC and IPC, the engineer will help shape qualification practices and packaging standards. It suits an experienced semiconductor, electronics, materials, mechanical, or reliability professional who can combine deep technical analysis with cross-functional leadership and clear communication.