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Updated daily · Sep 16, 2026
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Senior Principal Engineer, Global Product Management - Advanced Packaging

ASMPhoenix, AZFull-time

This position sits within ASM’s Advanced Packaging business and focuses on turning evolving semiconductor packaging needs into commercially successful products and technology roadmaps. The engineer will manage product platforms, define requirements, support new product introductions, and build business cases using market, competitive, and financial analysis. The role involves close collaboration with semiconductor manufacturers, foundries, OSATs, suppliers, research organizations, and internal teams spanning research, engineering, operations, applications, and sales. It also includes representing ASM at industry events and developing customer-facing technical and commercial materials. This opportunity suits a technically advanced, customer-oriented product leader with semiconductor industry experience who can connect complex engineering developments to market opportunity and business growth.

Requirements

5-10 years in semiconductor product management, technical marketing, applications, process engineering, or business developmentMaster’s or PhD in a relevant engineering or scientific disciplineExpertise in advanced packaging technologies such as hybrid bonding, chiplets, WLP, PLP, TSVs, RDL, and 2.5D/3D integrationKnowledge of semiconductor manufacturing processes and equipmentExperience working with manufacturers, foundries, OSATs, or advanced packaging organizationsStrong customer-facing, analytical, communication, and cross-functional leadership skills; willingness to travel globally
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Listed September 16, 2026 · Verify details with the employer before applying.

About ASM International

Semiconductor wafer processing/deposition equipment supplier with a 40-year Phoenix presence and a major new Scottsdale R&D/manufacturing campus.

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