EMIB-T Substrate Program Integrator

This position sits within Intel’s Advanced Packaging Technology Development organization and focuses on integrating EMIB-T substrate development across the technology lifecycle. The successful candidate will manage supplier enablement, qualification work, readiness reviews, and execution against development milestones. They will partner with global engineering, manufacturing, and assembly teams to resolve issues and align plans in both technology-development and high-volume production settings. The role is well suited to an experienced technical program leader with expertise in semiconductor packaging, substrate manufacturing, supplier management, and structured problem-solving. It requires comfort operating in ambiguous, high-pressure environments while using analytical and statistical methods to improve process performance and yield.