Package Development Engineer

This position is responsible for developing package structures that integrate passive components, active devices, and high-density substrates. The engineer will establish electrical, thermal, material, and interconnect approaches while guiding processes such as lamination, laser drilling, metallization, and assembly. They will also oversee reliability testing, failure investigations, and efforts to improve production yield, quality, scalability, and cost. Working across organizational boundaries, the role coordinates projects from early concepts through qualification and volume production. It is well suited to an experienced semiconductor packaging professional with strong embedded packaging knowledge, analytical problem-solving skills, and the ability to lead global technical partnerships.